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Mechanical Engineering

Faculty

Pak, Y. Eugene / 박유근 img
Pak, Y. Eugene / 박유근

Dr. Y. Eugene Pak has been very active in both industrial and academic research in various nano and biotechnology areas including MEMS sensors and actuators, AFM-based nano-storage, microfluidics IC chip cooling, bioMEMS lab-on-a-chip, nanopore DNA sequencing, and implant biomechanics, just to name a few. For the past several years, he has been concentrating on the theoretical and computational mechanics research. This includes the multiscale nanomechanics of defects in flexoelectric materials which involves couple-stress, strain gradient and electric field calculations around defects such as inclusions, dislocations and cracks. To have a better understanding of how these defects are formed and how they affect the electroelastic properties, continuum level modeling and molecular dynamics (MD) simulations are performed. Prompted by the recent COVID-19 pandemic, novel research is being initiated in the nanomechanical modeling of viruses wherein the methodologies of nonlinear continuum mechanics and elastic shell mechanics are applied to study the mechanical behavior of the virus capsid formation and its quantitative strength. A new elasticity model for virus capsid is being developed which will be useful in understanding the mechanical aspect of the infection processes that can lead to developing vaccines. This research will also enable nanomechanical engineering of artificial viruses that can be used in drug delivery for cancer treatment.

 

Education:

  • 1985, Ph.D., Stanford University, Mechanical Engineering
  • 1982, M.S., Stanford University, Mechanical Engineering
  • 1980, B.S., State University of New York (SUNY) at Buffalo, Mechanical Engineering

Experience:

  • 2023–Present, Dean, Academic Affairs, SUNY Korea
  • 2019–Present, Teaching Professor, Department of Mechanical Engineering, SUNY Korea
  • 2019-Present, Partner/Startup Mentor, S Cubic Angels
  • 2022–2023, Dean, Administration, SUNY Korea
  • 2009–2018, Director, Institute of Nano Convergence, Advanced Institute of Convergence Technology, Seoul National University 
  • 2005–2009, Vice President, CTO Office, Samsung Electronics
  • 2001–2004, BioMEMS Technology Leader, Biotechnology Team, Samsung Advanced Institute of Technology
  • 1996–2001, Director, Micro Systems Lab, Samsung Advanced Institute of Technology
  • 1994–1995, Research Associate Professor, Department of Mechanical Engineering, Stony Brook University
  • 1985–1994, Senior Researcher, Applied Mechanics Group, Grumman Aerospace Corporate Research Center


Courses Taught:

  • MEC 101: Freshman Design Innovation
  • MEC 260: Engineering Statics
  • MEC 262: Engineering Dynamics
  • MEC 410: Design of Machine Elements
  • MEC 440: Mechanical Engineering Design I
  • MEC 441: Mechanical Engineering Design II
  • MEC 455/530: Applied Stress Analysis
  • MEC 536: Mechanics of Solids
  • MEC 539: Introduction to Finite Element Method
  • MEC 541: Elasticity

Representative Research Grants:

  • NRF of Korea: “Space Exploration and In-Situ Resource Utilization Center (SRC),” Participating Researcher (PI: Jongseong Brad Choi), 475,000,000 KRW, Apr. 1, 2022~Dec. 31, 2026 (57 months). 

  • NRF of Korea: “Electroelastic Modeling of Flexoelectric Devices and Defect Mechanics Research,” Principal Investigator, 137,500,000 KRW, June 1, 2020~Feb. 28, 2023 (33 months).

  • NRF of Korea: “Prediction of Defects and Performance in Electronic Materials by Cosmic Radiation,” Participating Researcher, KRW 220,000,000, 2017.04.01~2020.03.31 (36 months).

  • NRF of Korea: “The development of defect mechanics-based multi-scale simulation techniques for reliability of high performance electronic devices in extreme environments,” Principal Investigator, KRW 500,000,000, 2014.7.1~ 2019.06.30 (60 months).
  • NRF of Korea: “The Development of Mechanics Analysis Models and Quantitative Estimation of Optoelectronic Performance for Improvement of Quantum Dot LED,” Principal Investigator, KRW 150,000,000, 2016.11.01~ 2019.10.31 (36 months).
  • NRF of Korea: “Korea-India Joint Network Center for Computational Material Science,” Participating Researcher, KRW 60,000,000, 2017.12.15~2018.12.14 (12 Months).
  • NRF of Korea: “Mechanics of Multi Quantum Well Thin Films: Prediction Models for Mechanical Strain and Piezoelectric Fields for GaN-based Devices under Different Growth Orientations,” Principal Investigator, KRW 150,000,000, 2013.11.1~2016.10.31 (36 months).
  • Samsung Electronics, "GaN Device Modeling Methodologies for TCAD Implementation," Principal Investigator, KRW 100,000,000, 2013.08.01~2014.07.31 (12 months).
  • Korean Ministry of Knowledge Economy: “Development of the Next Generation DNA Sequencer: Nanopore Device for Electrical Sensing of Single Molecules,” Sub-Principal Investigator, KRW 1,880,000,000, 2010.6.1~2013.6.31 (36 months).

 

Representative Publications: [Google Scholar Link]

  1. Sharma, R. K, Jangid, K. and Pak, Y. E., “The influence of bi-directional material gradation on a mode-III crack in functionally graded material via strain gradient elasticity theory,” European Journal of Mechanics / A Solids, Vol. 110, p. 105496, March-April 2025.
  2. Sharma, R. K, Jangid, K. and Pak, Y. E., “The influence of material gradation parallel to two unequal mode-III cracks in functionally graded materials via strain gradient elasticity theory,” Applied Mathematics Modeling, Vol. 136, p. 115647, December 2024.
  3. Sharma, R. K, Pak, Y. E. and Jangid, K., “A mode-III fracture analysis of two collinear cracks in a functionally graded material using gradient elasticity theory,” Acta Mechanica, Vol. 235, pp. 3783-3797, April 1, 2024.
  4. Duhan, N, Patil, R. U., Mishra B. K., Singh, I. V., Pak, Y. E. “Nonlinear thermo-elastic analysis of edge dislocations with internal heat generation in semiconductor materials,” Mechanics of Materials, Vol. 169, p.104322, 2022.
  5. Nguyen, A. T. et al., ''Quantification of the effects of misfit strain on the energy states of zinc-blende spherical core/shell quantum dots,"Journal of the Korean Physical Society, Vol. 79, pp. 87-94, 2021.
  6. Duhan, N, Patil, R. U., Mishra B. K., Singh, I. V., Pak, Y. E. “Thermo-Elastic Analysis of Edge Dislocation using Extended Finite Element Method,” International Journal of Mechancal Sciences,Vol. 192, 2021.
  7. Nguyen, A. T. et al., ''Quantification of the effects of misfit strain on the energy states of zinc-blende spherical core/shell quantum dots,"Journal of the Korean Physical Society, Vol. 79, pp. 87-94, 2021.

  8. Seo, Y., Jung, G.-J., Kim, I.-H., Pak, Y. E., “Configurational Forces on Elastic Line Singularities,” Journal of Applied Mechanics, Vol. 85, 2018.

  9. Mishra, D., Lee, S. H., Seo, Y., Pak, Y. E., “Modeling of stresses and electric fields in piezoelectric multilayer: Application to multi quantum wells,” AIP Advances, Vol. 7, p. 075306, 2017.

  10. Seo, S. Y., Yoo, S. S., Mishra, D., Park, S.-H., Pak, Y. E., “Exact piezoelectric solution for misfitted inclusion in finite spherical matrix: Applications to quantum dot core/shell crystals,” International Journal of Solids and Structures, Vol. 94-95, pp. 158~169, May 10, 2016.

Book Chapters

  1. Pak, Y. E., Mishra, D., Yoo, S. H., “Fracture Problems in Antiplane Piezoelectricity,” in Recent Trends in Fracture Mechanics, Editor: Y. Prawoto, Nova Science Publishers, Inc., 2012.
  2. Pak, Y. E., and Rhee, W., “Convergence Science and Technology at Seoul National University,” in Handbook of Science and Technology Convergence, Editors: W. Bainbridge and M. C. Roco, Springer, pp. 985-1006, April 14, 2016.
  3. Nguyen, A. T., Garnaik, S. S., Kienzler, R. and Pak, Y.E., “Chapter 8: Path-Independent Integrals and Their Applications in Fracture and Defect Mechanics,” in Deformation and Fracture in Materials: Advances in Experimental and Numerical Studies, Editors: A.K. Mukhopadhyay and D. Mishra, CRC Press, 2024.
  4. Kienzler, R., Nguyen, A. T., and Y. E. Pak, “M-integral and Energy-Release Rates: A Didactical Account,in New Achievements in Mechanics – A Tribute to Klaus Peter Herrmann, Editors: W. H. Müller, A. Noe and F. Ferber, Springer, May 27, 2024.