Department of Mechanical Engineering, Stony Brook University, 87 - present
Senior Fellow, National University of Singapore, 97-98
Visiting Research Fellow: Tokyo Institute of Technology, 94-94
Research Interests and History
Toshio Nakamura's research area is in the computational stress and fracture analysis of various materials and structures. His studies include the detailed stress and failure investigation of multi-phase materials used in electronic packaging, failure mechanisms of laminated structures, and development of nonlinear constitutive equation of composite solids. Recent research activities also cover the investigations of various mechanical aspects of thermally sprayed coatings. Nakamura has organized several fracture and FGM symposiums and is the Chair of Fracture and Failure Committee (1999-01) in Applied Mechanics Division of ASME. He was a senior participant of NSF MRSEC Center on Thermal Spray at Stony Brook. Nakamura was a visiting research fellow at Tokyo Institute of Technology for seven months in 1993, and spent six month as a senior fellow at the National University of Singapore with the joint appoint with the Institute of Material Research and Engineering in 1997. He has received Ross Coffin Purdy Award from the American Ceramic Society in 1992 and authored/co-authored over forty research articles in journals and proceedings.